基于逆子结构的产品包装耦合系统传递路径分析  

Transfer Path Analysis of Product Packaging System Based on Dynamic Inverse Sub-structuring Theory

作　　者：王启利 王军[1,2] 

机构地区：[1]江南大学,无锡214122 [2]江苏省食品先进制造装备技术重点实验室,无锡214122

出　　处：《包装工程》2015年第19期7-12,37,共7页Packaging Engineering

基　　金：国家自然科学基金(51205167);中央高校基本科研业务费重点项目(JUSRP51403A);教育部博士点基金(20120093120014);江苏省青蓝工程(2014)

摘　　要：目的以产品包装耦合系统为研究对象,基于动态逆子结构技术,利用传递路径分析法研究对目标系统级传递函数峰值贡献量影响最大的子结构传递函数,并找出耦合界面特征参数对力传递率的影响规律,从而更好指导缓冲包装设计。方法通过建立二级多点耦合系统集总参数模型,以此来研究各子结构传递函数,以及各耦合点对目标系统级传递函数的贡献量,研究耦合点处物理参数对力传递率贡献量的影响规律。结果找到对主要传递路径影响最大的子结构传递函数,以及耦合点处刚度及阻尼对力传递率贡献量的影响规律。结论无需拆卸系统,即可实现路径贡献量分析,高效地识别各子传递路径对目标系统级传递函数峰值的贡献量,揭示包装耦合界面物理参数对传递贡献的影响本质,从而为指导缓冲包装的设计和优化提供理论支撑和技术指导。A novel TPA method was proposed to study the product packaging coupling system based on the spectral-based substructuring technique. The new method was applied to study the component level transfer function which made the largest contribution to the target system transfer function, and to find out the influencing law of the coupling interface characteristic parameters on the force transfer rate, so as to better guide the design of cushioning packaging. A two-substructure multi-coordinate coupled system lumped parameter model was used to study the component level transfer function and the contributions of the various coupling points to the target system transfer function. Also the influencing law of the special physical parameters at the coupling interface on the force transfer rate was studied. As a result, the component level transfer function with the largest contribution to the target system transfer function was found out, as well as the influencing law of the stiffness and damping at the coupling interface on the force transfer rate. In conclusion, the novel method was proved to be efficient and feasible to be applied in path contribution analysis, and it could efficiently recognize the contributions of the sub-structuring transfer pathways to the peak value of the target system transfer function, as well as reveal the influence of the physical parameters at the packaging coupling interface on the transfer contribution. And it provides much theoretical support and technical guidance for the design and optimization of cushioning packaging.

关 键 词：传递路径分析 逆子结构 频响函数 

分 类 号：TB485.3[一般工业技术—包装工程]