Sn3.0Ag0.5Cu0.05Cr/Cu焊点界面IMC层热时效形貌及生长行为研究  

Interfacial IMC Layer Morphology and Growth Behavior of Sn3.0Ag0.5Cu0.05Cr/Cu Solder Joints during Isothermal Aging

作　　者：谢仕芳[1] 韦习成[2] 鞠国魁[2] 徐可心[2] 

机构地区：[1]江西省科学院应用物理研究所,江西南昌330029 [2]上海大学,上海200072

出　　处：《稀有金属材料与工程》2015年第9期2234-2239,共6页Rare Metal Materials and Engineering

基　　金：江西省钨铜新材料重点实验室开放课题(2010-WT-02)

摘　　要：研究了Sn3.0Ag0.5Cu0.05Cr焊料(SACCr)制成的Cu/Solder/Cu焊点在150℃时效0、168、500及1000 h下界面金属间化合物(IMC)层的形貌及生长行为,并与Sn3.0Ag0.5Cu(SAC)焊料的焊点进行了比较。结果表明,相对于SAC的焊点,SACCr中弥散或固溶分布的微量Cr延缓了焊点界面IMC层的生长。时效时间越长,Cr的阻抑效果越明显。150℃时效1000 h的Cu/SACCr/Cu焊点界面IMC层的平均厚度是Cu/SAC/Cu的45%,仅为5.13μm。The morphology and growth behavior of interfacial intermetallic compound（IMC） layer for the Sn3.0Ag0.5Cu0.05Cr（SACCr）/Cu joints after isothermal aging at 150 °C for 0, 168, 500 and 1000 h were investigated, and they were compared with Sn3.0Ag0.5Cu（SAC）. The results show that the trace Cr dispersed or dissolved in SAC solder effectively inhibits the IMC layer growth at the interface of SACCr/Cu joints. The longer the aging time, the more obvious the inhibiting effect of Cr on the overgrowth of IMC layer of solder/Cu joints. The average thickness of IMC layer of SACCr/Cu solder joints is about 5.13 μm after aging for 1000 h, only 45% of that of the SAC/Cu solder joints.

关 键 词：SNAGCU 无铅焊料 铬 金属间化合物 热时效 

分 类 号：TG454[金属学及工艺—焊接]