IC封装溢料低温低碱高效软化液的开发  

Development of Chemical De-flash at low temperature and low alkaline condition for IC Plastic Package

作　　者：卢建红[1,2] 胡青华 谢立洋 赵建龙 

机构地区：[1]昆山艾森半导体材料有限公司,江苏苏州215341 [2]北京科技大学钢铁冶金新技术国家重点实验室,北京100083

出　　处：《中国集成电路》2015年第10期69-73,共5页China lntegrated Circuit

摘　　要：去溢料工序是IC封装件电镀前的关键工艺,本文介绍了不同溢料除去方法的优劣,着重讨论了DFI-120低温低碱软化液的退除效果,及软化液的稳定性。本文还从封装体溢料软化清除的可靠性角度,测试了DFI-120用超声波检测、易焊性,及溶液对铜、不锈钢等材料的腐蚀性,通过综合分析,认为DFI-120具有除去效率高、安全、可靠等特性。De-flash is one of key processes for plating pretreatment of IC Plastic package, advantages and disadvan- tages of different de-flash methods were introduced. In this paper, removal effect of DFI-120 de-flash solution was discussed, and there also is research on stability of DFI-120 product. From the perspective of reliability, features of IC Plastic package parts were tested by some detecting methods, including scanning acoustic technology （ SAT ）, solder- ability and corrosive parameters of copper and stainless steel. Those test results show the DFI-120 agent is safe and reliable with high de-flash efficiency.

关 键 词：IC封装 溢料 化学法软化 可靠性 

分 类 号：TQ153[化学工程—电化学工业]