复合金属镀层测试方法研究  

Research on Test Method of Composite Metal Coating

作　　者：刘磊[1] 黄波[2] 卢思佳[1] 周帅[1] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610 [2]中国国防科技信息中心,北京100142

出　　处：《电子产品可靠性与环境试验》2015年第6期43-46,共4页Electronic Product Reliability and Environmental Testing

摘　　要：目前,国内主要采用X射线荧光测厚法和常规的金相切片法对电子元器件复合金属镀层的厚度进行测量,但这两种方法均存在一定的局限性。因此,提出了一种改进的金相切片法,并对该方法的测量步骤进行了介绍。该方法在常规的金相切片法的基础上增加了镀膜预处理过程,从而实现了对电子元器件复合金属镀层的厚度的准确测量。At present, the thickness of the metal composite coating of electronic component is mainly measured through X-ray fluoressene thickness measurement method and conventional metallographic method, but both methods have some limitations. Therefare, an improved metallographic method is put forward, and the spec＇ific measurement procedures of the method are introduced. A pretreatment process is added to the improved method on the basis of the conventional metallographic method, so the improved method can effectively control the metal ductility, and then realize the accurate measurement of the thickness of metal composite coating of electronic component.

关 键 词：复合金属镀层 厚度 X射线荧光测厚法 金相切片法 测量步骤 

分 类 号：TG174.4[金属学及工艺—金属表面处理]