一种T/R组件热场问题的研究  

Thermal Analyze and Research of High Integrated T/R Module

作　　者：周骏[1,2] 刘伟 盛重[2] 沈亚[1,2] 

机构地区：[1]微波毫米波单片集成和模块电路重点实验室,南京210016 [2]南京电子器件研究所,南京210016 [3]空军驻江苏地区军事代表室,南京210016

出　　处：《电子与封装》2015年第12期38-42,共5页Electronics & Packaging

摘　　要：T/R组件的热设计是有源相控阵雷达的核心技术之一。文章提出了针对高密度组件的各种散热措施,采用热仿真软件对T/R组件沟道温度进行仿真研究,并利用红外热分析仪进行测试验证,并将仿真结果与实验结果进行对比,两者结果吻合较好,满足T/R组件的使用要求。Thermal design of T/R module is one of the key technologies in application of active phase array radar. According to the high integrated T/R module, various methods are proposed to spread the heat in this paper. The channel temperature of PHEMT is analyzed using thermal simulator software and the temperature is tested by infrared analyze instrument. The comparison between simulated and tested results shows that the presented designs are validated to T/R modules.

关 键 词：T/R组件 热设计 高密度 

分 类 号：TN802[电子电信—信息与通信工程]