具有纳米结构的增强颗粒对SnBi焊点电迁移的影响  

Effects of Nano-Structured Reinforcements on the Electromigration Behavior of SnBi Solder Joints

作　　者：张睿竑[1] 徐广臣[1] 邰枫[1] 郭福[1] 夏志东[1] 雷永平[1] 

机构地区：[1]北京工业大学,北京100124

出　　处：《稀有金属材料与工程》2011年第S2期45-50,共6页Rare Metal Materials and Engineering

基　　金：北京市教育委员会科技计划重点项目(KZ200910005004)

摘　　要：探究了颗粒增强无铅复合钎料的电迁移特性。试验采用具有纳米结构的笼型硅氧烷齐聚物(POSS)颗粒作为增强颗粒,制备SnBi基复合钎料。在25oC,104A/cm2条件下,对钎料一维焊点实施不同时间的通电试验,并对焊点表面形貌和内部显微组织进行观察。结果表明,相对于共晶SnBi焊点,POSS颗粒增强复合钎料焊点的电迁移现象明显受到抑制。通电336h后,复合钎料焊点表面变化很小,界面处聚集的富Sn和富Bi层厚度很小,表明POSS颗粒能够有效抑制通电焊点中的物质扩散。This study focuses the electromigration behavior of the particle-reinforced lead-free composite solder. The nano-structured cage-type polyhedral oligomeric silsesquioxane (POSS) particles were used as the reinforcements to fabricate the SnBi-based composite solders. In the experiment, the as-reflowed one-dimensional composite solder joints were stressed with current density in the magnitude of 104 A/cm2 at 25 o C. The surfacial evolution and interior microstructure were observed and analyzed. The results show that the electromigration behavior was restricted significantly in composite solder joints with POSS particles, compared to that in eutectic SnBi solder joints. After 336 h current stressing, only few changes occur at the surface of such composite solder joints and the total thicknesses of the accumulative Sn and Bi layers at the interfaces are thinner than those formed in SnBi solder joints. It can be concluded that POSS particles can effectively inhibit the mass transportation in the solder joints under current stressing.

关 键 词：电迁移 无铅钎料 POSS颗粒 

分 类 号：TG425[金属学及工艺—焊接]