稀土Sm对Sn-Cu-Ni钎料熔点、润湿性和界面组织的影响  

Effect of rare earth Sm on melting point,wettability and interfacial microstructure of Sn-Cu-Ni solder

作　　者：孟工戈[1] 康敏[1] 仇爱梅[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《电焊机》2016年第1期18-22,共5页Electric Welding Machine

摘　　要：以Sn-0.7Cu-0.05Ni-XSm钎料为研究对象,其中稀土元素钐（Sm）的含量分别为0,0.025%,0.05%,0.1%和0.2%。采用差示扫描量热仪测量钎料的熔点,通过Auto CAD测算钎料在紫铜片上的铺展面积来研究Sm含量对润湿性的影响,使用扫描电镜观察钎料与裸铜PCB板形成的焊点界面化合物。结果表明,Sm含量为0.05%时钎料熔点最低,为226.81℃;Sm含量为0.1%时钎料铺展面积最大,为51.84mm2;Sm含量为0.025%~0.1%时,界面化合物变平整、厚度减小。这表明在钎料中添加微量的Sm有助于抑制界面化合物的生长,形成优良的接头。In this paper,Sn-0.7Cu-0.05Ni-XSm solder is the research object,in which the content of rare earth element samarium （Sm）is 0,0.025%,0.05%,0.1% and 0.2% respectively. The melting point is measured by differential scanning calorimeter,the effect of Sm on the wettability is studied by measuring the spreading area on copper sheet with AutoCAD,and the interface formed by the solder and the bare copper PCB substrate is studied with scanning electron microscope. The results show that,when the Sm content is 0.05%,the melting point is the lowest,which is 226.81 ℃ ;when the Sm content is 0.1%,the spreading area is the largest,which is 51.84 mm2;when the Sm content is between 0.025% and 0.1% ,it can make the intermetallic compounds smooth and reduce its thickness. This suggests that trace amount of Sm＇s addition can help to inhibit the growth of intermetallic compounds and form good soldering joints.

关 键 词：Sn-0.7Cu-0.05Ni 熔点 润湿性 界面化合物 SM 

分 类 号：TG425[金属学及工艺—焊接]