SiC_p/2024Al复合材料与SiC陶瓷的软钎焊  

Soldering of SiC_p/2024Al composites to SiC ceramic

作　　者：雷玉珍 宋晓国 胡胜鹏 闫强强 

机构地区：[1]哈尔滨工业大学(威海)山东省特种焊接技术重点实验室,264209

出　　处：《焊接》2016年第3期14-17,73,共4页Welding & Joining

基　　金：国家科技重大专项(2014ZX04001131)

摘　　要：采用Sn3.0Ag0.7Cu钎料对表面电镀铜后的增强相体积为45%的SiC_p/2024Al复合材料和表面化学镀铜后的SiC陶瓷进行钎焊,利用扫描电镜、材料试验机等研究了钎焊接头的显微组织、剪切断口形貌以及钎焊保温时间对接头组织和性能的影响。结果表明:表面电镀铜后的SiC_p/2024Al复合材料能够实现与表面化学镀铜的SiC陶瓷的软钎焊,在260℃下保温0.5min能得到剪切强度为24MPa的接头,焊缝组织致密,钎料对电镀铜后的SiC_p/2024Al复合材料和化学镀铜后SiC陶瓷的润湿性都良好,断裂部位发生在铝基复合材料与电镀铜结合处以及电镀铜层较薄弱处。The SiC_p/2024 Al composites with 45 vol. % of SiC_particles after surface copper plating were soldered to SiC ceramic after surface electroless copper plating by using Sn-3. 0Ag-0. 7Cu solder. The microstructure,shearing fracture morphology and effects of holding time on the microstructure and properties of the joint were analyzed by means of scanning electron microscopy and shearing testing. The results show that the SiC_p/2024 Al composites after surface copper plating can be joined to SiC ceramic after surface electroless copper plating by means of soldering. The joint with shearing strength of 24 MPa is achieved at the soldering temperature of 250 ℃ for 0. 5 min,the microstructure of soldered seam metal is quite compact,the solder can wet well on both the SiC_p/2024 Al composites and SiC ceramic,which the joint fracture occurs on the joint of aluminum matrix composites and copper plating or the position where the copper plating is thinner.

关 键 词：SICP/2024AL复合材料 SIC陶瓷 电镀铜 化学镀铜 软钎焊 

分 类 号：TG454[金属学及工艺—焊接]