纳米Sn-Ag钎料合金熔化温度及形成焓的研究  

An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy

作　　者：吴敏[1] 吕柏林[1] 

机构地区：[1]辽宁石油化工大学机械学院,辽宁抚顺114001

出　　处：《电子学报》2016年第1期222-226,共5页Acta Electronica Sinica

基　　金：辽宁省教育厅科学研究计划(No.2008382);辽宁石油化工大学科学基金(No.xjj2013-005)

摘　　要：考虑表面效应,基于Lindemann熔化准则,利用Miedema模型对Sn-Ag纳米钎料合金的熔化温度及形成焓进行计算.Sn-Ag纳米合金微粒的熔化温度及形成焓均依赖于尺寸和组元成分;对于Sn3.5Ag纳米钎料合金,当微粒尺寸大小为5nm时,其熔化温度下降约为7%;而合金形成焓随晶粒粒径的减小而增加,合金稳定性降低;对于Sn3.5Ag钎料合金,当粒径尺寸为0.1μm时,合金形成焓完全为正值,对Sn-Ag钎料合金组织形成存在产生很大影响.Considering the surface effect,the melting temperature and the formation enthalpy of Sn-Ag nanoscale solder alloy were calculated by Miedema model using Lindemann melting criterion. The results showthat the melting temperature and the formation enthalpy of Sn-Ag nanoscale solder alloy are dependent on the grain size and component composition. When the particle size is 5nm,the melting temperature decreased by about 7% for Sn3. 5Ag nanoscale solder alloy;while the formation enthalpy of the alloy increases with the decrease of particle size,and the alloy stability decreases accordingly. Meanwhile,the formation enthalpy of the Sn3. 5Ag solder alloy is completely positive when the grain size is 0. 1μm,which can create significant influence on the microstructure formation of the Sn-Ag solder alloy.

关 键 词：电子封装 SN-AG 无铅钎料 纳米 熔化温度 形成焓 

分 类 号：TG42[金属学及工艺—焊接]