晶圆无氰电镀金厚度均匀性研究  

Research on the uniformity of the Gold layer thickness using non-cyanide electroplating on wafer

作　　者：王川宝 王强栋 刘相伍 

机构地区：中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《世界有色金属》2016年第4期173-175,共3页World Nonferrous Metals

摘　　要：针对晶圆正面无氰电镀金均匀性差的问题,通过分析电镀均匀性的影响因素,设计单因素对比实验,研究了晶圆挂镀无氰镀金工艺中阴极扎针个数、阴阳极距离、均匀性挡板开孔尺寸四个因素对正面镀金层厚度均匀性的影响,分析了各因素的影响机理。确定最佳工艺条件为：压四根针,阴极抖动频率为40次/分钟,均匀性挡板开孔尺寸为70cm。生产过程中镀层目标后的为4μm时,均匀性可控制在0.23m以内。Focusing on the problem of the uniformity during wafer front non-cyanide gold electroplating, single factor experiments have been designed to research the factors affecting the thickness of the plating uniformity. The influence of the four parameters on the gold layer have been studied, including the number of the cathode needles, the distance between the cathode and the anode, and the dimension of the hole on the uniformity mask. The influence mechanisms of the four parameters have been analyzed meanwhile. The optimized parameters are as follows： four cathode needles, shaking the cathode at the frequency of 40 times per minute, keeping the distance for 14cm between the cathode and anode and the dimension of the hole on the uniformity mask for 70cm. When the thickness of the gold plating layer is 4μm during the production process, the uniformity was controlled within 0.2 μm.

关 键 词：无氰镀金 镀层均匀性 晶圆 均匀性挡板 

分 类 号：TQ153[化学工程—电化学工业]