微孔互连无氰电镀金工艺研究  

Research on the non-cyanide gold electroplating in the interconnection via

作　　者：王川宝 胡泽先 王伟 

机构地区：中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《世界有色金属》2016年第5期148-150,共3页World Nonferrous Metals

摘　　要：针对高深宽比互连微孔内金镀层存在空洞问题，使用挂镀电镀台和喷镀电镀台在不同电流密度下进行了微孔互连电镀实验，研究了两种电镀台电镀过程中镀液流场的差异，分析了两种电镀台电镀结果存在明显差异的原因。采用FIB对电镀样品互连孔的剖面进行观察，结果显示，使用喷镀电镀台电流密度为0．2ASD时，介质孔内金镀层未见空洞，金镀层与介质孔壁之间无裂纹。确定介质孔内金镀层形成空洞的原因为：随着电镀进行，介质孔内镀液浓度降低，镀速下降，逐渐形成“自掩蔽”空洞。喷镀电镀具有可以促进孔内镀液交换，实现高深宽比微孔实心镀金的优势，是今后微孔实心电镀发展的重要方向之一。Focusing on the problem that holes exist in the gold layer in the interconnection via of large ratio of depth to width, the experiments plating gold in the interconnection via have been carried out with different current density using the rack electroplater and spraying electroplater. The reason for the significant different results between the two kinds of electroplaters was analyzed, and the influence of the bath flowing on the gold in via has been researched. FIB was adopted to observe the profile of the gold layer in the interconnection via. No hole has been observed in the gold layer in medium via using spraying electroplater using the current density of 0.2ASD, and the gold layer combined with the medium via wall well. The reason to the hole in the gold layer in via has been determined： the bath concentration decreased, which leads to the reduction of the deposition rate, and ＂self-masking＂ holes are formed. Spraying electroplater can improve the quality of gold layer in the interconnection via, and spraying electroplating is one of the development directions for the interconnection via gold electroplating.

关 键 词：无氰镀金 互连微孔 喷镀电镀 

分 类 号：TQ153[化学工程—电化学工业]