MEMS器件用叠层镍间结合强度的研究  

Study on Adhesion Between Stacked Nickel Layers in MEMS Devices

作　　者：李雪萍 张丛春[2] 姚锦元[2] 王艳[2] 汪红[2] 丁桂甫[2] 赵小林[2] 

机构地区：[1]上海飞机客户服务有限公司,上海200241 [2]上海交通大学微米/纳米加工技术国家级重点实验室,上海200240

出　　处：《复旦学报（自然科学版）》2016年第2期205-208,214,共5页Journal of Fudan University：Natural Science

基　　金：教育部科技支撑项目(625010105);上海市基础研究项目(12JC1404902);中国工程物理研究院超精密加工技术重点实验室开放基金(KF13001)

摘　　要：针对MEMS器件用叠层镍间结合强度差这一难题,开展了基于盐酸化学刻蚀提高叠层镍间结合强度的工艺研究.主要考查了不同盐酸浓度、处理温度等对镍层层间结合强度的影响规律.借助SEM、Veeco轮廓分析仪等观察断面,分析结合强度改善的原因.结果表明:在45℃的温度下,经过50%HCl、10 min的化学刻蚀,叠层镍间结合强度达到567.7 MPa,比未经化学刻蚀处理的叠层镍间结合强度提高了6倍.通过SEM、Veeco等分析手段,初步解释了结合强度提高的原因.In order to enhance the adhesion strength between the stacked nickel layers, nickel films were etched by HC1 solution. The effects of HC1 concentration and temperature on the adhesion strength were investigated. The fracture surface was examined by SEM and Veeco profiler. The results show that the adhesion strength was greatly increased to 567 MPa when the nickel layer was etched in 50% HC1 for 10 min at 45 ℃, which was 6 times more than that not etched in HCI.

关 键 词：镍叠层微结构 化学刻蚀 粗糙度 结合强度 

分 类 号：TQ153[化学工程—电化学工业] TG156[金属学及工艺—热处理]