一种WLCSP元器件先进运输包装材料解决方案  

Advanced Transport Package Material Solution for WLCSP Component

作　　者：杨青[1] 

机构地区：[1]3M中国有限公司北方技术分公司,北京100176

出　　处：《电子与封装》2016年第6期43-47,共5页Electronics & Packaging

摘　　要：报道了一种用于WLCSP电子元器件的先进运输包装材料,即3M先进载带盖带技术。首先介绍了WLCSP元器件的特点及其对运输包装材料的特殊需求,重点介绍了3M先进载带和盖带技术针对这些需求的解决方案。由PC材质制作成的载带,其强度高、不易变形,能更好地保护元器件。特殊的一体化成型工艺提供了高尺寸精度载带,能更好地匹配元器件尺寸。专利性的设计方案既保护了元器件不易受损也保证了贴片的高效率。同时,3M洁净载带产品满足了WLCSP元器件的高洁净度要求。同时介绍了压敏型防粘盖带,其具有更稳定的剥离力,而且采用防粘材料也大大解决了元器件和盖带粘料的问题。3M advanced carrier tape and cover tape solutions for WLCSP component transport package is presented in the paper. The paper at first briefly introduces the WLCSP component and its special requirements for transport packaging materials which could be met by 3M advanced carrier tape and cover tape solutions. The PC resin-made carrier tape exhibits good mechanical strength and resistance to deformation and better protects component. Special integrated molding guarantees precise dimension. Patented pocket design protects WLCSP component and ensures efficient SMT. Meanwhile,3M high-purity carrier tape meets the strict requirement of WLCSP components. The paper also introduces the pressure-sensitive cover tape with anti-stick property, which has more stable peel force.

关 键 词：WLCSP 载带 盖带 

分 类 号：TN305.99[电子电信—物理电子学]