磁控溅射玄武岩纤维基纳米Cu薄膜微观结构分析的研究  

Microstructural analysis of deposited copper film on basalt fiber

作　　者：徐文正[1,2] 魏取福[1] 杨莉[2] 魏安方[2] 凤权[2] 

机构地区：[1]江南大学生态纺织教育部重点实验室,无锡214122 [2]安徽工程大学纺织面料安徽省高校重点实验室,芜湖241000

出　　处：《化工新型材料》2016年第7期136-138,142,共4页New Chemical Materials

基　　金：安徽省高等教育提升计划省级科学研究项目(TSKJ2015B28;TSKJ2014B21);安徽省高等学校纺织面料重点实验室开放基金资助(2015FZ003)

摘　　要：采用直流磁控溅射法在玄武岩纤维表面沉积纳米Cu薄膜,工作气体为氩气,利用原子力显微镜(AFM)和扫描电子显微镜(SEM)观察Cu薄膜在纤维表面的微观结构,并较为系统地分析了磁控溅射工艺参数对Cu薄膜表面颗粒尺寸、表面粗糙度等的影响,采用X射线能谱仪(EDX)分析了溅射前后表面各元素的含量。结果表明:随着溅射功率的增大,溅射时间的延长其表面颗粒的团聚增强;溅射压强增大会导致表面粗糙度增大;基底温度的升高会导致Cu粒子热迁移现象,表面粗糙度增大,但对表面裂纹的产生有一定的改善,并利用AFM测试了裂纹的宽度和深度。Copper thin films were deposited on BF（basalt fiber）by DC（direct current）magnetron sputtering using Cu target and Ar（argon）as the working gas.AFM（atomic force microscope）and SEM（scanning electron microscope）were used to observe the microstructure of Cu thin films deposited on the surface of basalt fibers.The effects of several DC sputtering parameters on particle size and surface roughness of Cu thin films were investigated.A full energy dispersive X-ray analysis（EDX）was applied to study the chemical elements of basalt fiber before and after sputter coating.The results showed that：the surface particles aggregated with the increase of sputtering power and sputtering time.The surface roughness increased with the sputtering pressure.It was found that higher substrate temperatures caused increase of surface roughness due to the migration of Cu nanoparticles,but the number of cracks on the surface reduced,and the width and depth of cracks were tested by AFM.

关 键 词：玄武岩纤维 磁控溅射 铜薄膜 微观结构 

分 类 号：TB383.2[一般工业技术—材料科学与工程]