基于SMT技术的组装新工艺探讨  

New Assembly Process Discussion Based on SMT

作　　者：赵少伟[1] 张婧亮[1] 韩春[1] 

机构地区：[1]中国电子科技集团公司第二十九所,四川成都610036

出　　处：《电子工艺技术》2016年第4期191-195,共5页Electronics Process Technology

摘　　要：随着SMT技术在深度和规模上不断发展,SMT技术的应用领域不断扩大,从传统的板级组装逐步扩展到器件级组装和模块级组装,并融合创新出很多新的研究热点。通过摸索实践,对基于SMT技术衍生发展的几个新兴技术进行分析,主要包括在板Po P工艺、WLCSP芯片DCA组装工艺、MOB组装工艺和SIP工艺,阐述其工艺内含、实现方式、技术难点及实践体会。With the continuous development of the SMT technology in depth and scale, the application of the technology has been exploring increasingly from the PCBA to device and Module assembly. And some new research hotspot is developing on it. Provide an overview of the research hotspot, concluding the Po P on board, WLCSP with DCA, MOB and SIP process. Discuss the structural forms, the processing, the difficulties and some practical experiences.

关 键 词：SMT POP WLCSP MOB SIP 

分 类 号：TN605[电子电信—电路与系统]