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机构地区:[1]中国电子科技集团公司第55研究所,江苏南京210016
出 处:《电子工艺技术》2016年第4期225-227,248,共4页Electronics Process Technology
摘 要:手工/半自动生产方式,在产品质量、一致性以及产能要求方面均已经很难满足微波多芯片组件正不断向小型化、高密度、高可靠、高性能和大批量生产方向发展的需求。自动化贴片具有可控化、高精度、一致性好和效率高等绝对优势。通过吸头的选取和划胶图形的设计确保自动贴片良好完成,并对试验样品进行镜检和X-射线检测,完全满足产品要求。微波多通道T/R组件可以实现自动贴片工艺。With the development of MMCM toward the miniaturization, high density, high reliability, high performance and mass production, the product quality, consistency and productivity can not be met by manual/semi-automatic mode of production. Automatic SMT process is of many advantages, including controllable, high-precision, good consistency, high efficiency and so on. Through nozzle choice, glue graphic design and so on, the automatic SMT process of MMCM was achieved. The samples were tested by microscope and X-ray inspection. The results showed that they fully meet the product requirements.
分 类 号:TN605[电子电信—电路与系统]
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