混合集成电路组装中的共晶焊技术  

The Eutectic Soldering Technology of the Assembling in Hybrid Integrated Circuit

作　　者：杨宗亮[1] 俸绪群 

机构地区：[1]中华通信系统有限责任公司河北分公司,河北石家庄050081 [2]河北诺亚人力资源开发有限公司,河北石家庄050035

出　　处：《电子测试》2016年第8期56-57,共2页Electronic Test

摘　　要：共晶焊是元器件组装的一种重要方式,在混合集成电路组装中有着重要的地位。阐述了共晶焊的概念及其特点,比较了镊子共晶焊等共晶焊设备的优缺点,介绍了相关共晶焊料的基本特性和常用形态,分析了影响共晶焊质量的相关关键因素,并讲解了共晶质量的检测方法。Eutecticsoldering is one important way of assembly of components.It plays an important role in the assembly of hybrid integrated circuits.This thesis describes the concept and characteristics of eutectic soldering,compares the advantages and disadvantages of eutectic soldering equipment,such as tweezers eutectic equipment.The basic characteristics and common form of solder are introduced.Analyzes the key factors which influencing eutectic quality,and explain the test method of eutectic quality.

关 键 词：共晶焊 混合集成电路 剪切力 

分 类 号：TN405[电子电信—微电子学与固体电子学]