脉冲电镀优化金镀层性能的工艺研究  

Optimization Research on the Process of Gold Pulse Plating through Orthogonal Test

作　　者：陈楠[1] 熊瑛[2] 郭亮[2] 田扬超[2] 刘刚[2] 

机构地区：[1]中国科学技术大学精密机械与精密仪器系,安徽合肥230027 [2]中国科学技术大学国家同步辐射实验室,安徽合肥230029

出　　处：《新技术新工艺》2016年第9期7-11,共5页New Technology & New Process

基　　金：国家重点基础研究发展计划(973项目)(2012CB825804)

摘　　要：镀金工艺是许多大高宽比微纳结构实现其功能化的重要技术手段。由于其结构的特殊性,往往需要获得晶粒小、致密均匀的金镀层,才能满足微纳元器件的需求。针对微纳米结构金属化的要求,研究了柠檬酸金钾脉冲电镀工艺,通过正交试验法确定了脉冲电镀过程较优的工艺参数,分析了主要的电镀工艺参数(平均电流密度、占空比和频率)对沉积速率、镀层形貌及金颗粒大小的影响,给出了优化的工艺参数:平均电流密度为1.8A/dm2、占空比为20%、频率为6kHz。试验结果表明,优化工艺参数下的金镀层致密均匀,颗粒度小且色泽好,能够满足微纳米结构金属化的要求。During high aspect ratio micro and nanostructures fabrication processes, the gold plating is a key process to ensure the structures have certain function. In order to meet the special characteristic of micro and nano components, high- quality gold coatings with finer-grained need to be gotten. The process of plating based on gold potassium citrate is studied. Orthogonal test is used to obtain the preferred parameters in the pulse plating process. Gold coating appearance, deposition rate and surface morphology are measured and analyzed. The effects of pulse frequency, pulse occupy and pulse current density on gold coatings property and deposition rate were studied, and the optimum pulse plating parameters are： the average current density 1.8 A/dm2 , pulse occupy 200//oo, and pulse frequency 6 kHz. The surface morphology of the gold coatings is observed by SEM. The results indicated that a finer-grained and good-uniformity gold deposit with good characteristics could be obtained by the optimum pulse plating parameters. Thus, the demand of micro and nanostructures metallizing process is met.

关 键 词：正交试验法 脉冲镀金 微纳结构 

分 类 号：TQ153[化学工程—电化学工业] TN305[电子电信—物理电子学]