硬脆材料的激光引导冷分离技术  

Laser Guide Cold Split Technology for Hard and Crisp Ingot

作　　者：张孝其[1] 张雨[1] 韩微微[1] 王宏智[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2016年第9期1-2,33,共3页Equipment for Electronic Products Manufacturing

摘　　要：介绍了一种新型、节能的硬脆材料分离技术。该技术使用隐形激光打点使晶锭上部形成分离层,通过将高分子分离材料涂覆在待分离的晶圆薄片表面并冷冻使晶圆薄片分离。描述了该技术的主要工作流程和工艺特点,将该技术与目前常用的金刚线切割技术进行了比较,分析了该技术的特点并展望了该技术的应用前景。This paper introduces a cold split method for split SIC ingot or some other hard and crisp materials, describes the system composition, compares this method with wire sawing, and describes the forward of this new technology. This cold split method can be tread as a revolution, it is efficient, and can solve the partitioned sawing difficulties in sawing of large-diameter crisp and hard materials such as SIC with kerf-loss.

关 键 词：激光隐形打点 等离子扫描 冷冻分离 

分 类 号：TN305.1[电子电信—物理电子学]