柔性电子封装技术研究进展与展望  

Research Progress and Prospect of Package Technology for Flexible Electronics

作　　者：王高志全 何欣怡[1] 唐宏伟[1] 谢梓建 赵一[1] 夏卫生[1] WANG Gao-zhi-quan HE Xin-yi TANG Hong-wei XIE Zi-jian ZHAO Yi XIA Wei-sheng(School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, Chin)

机构地区：[1]华中科技大学材料科学与工程学院,湖北武汉430074

出　　处：《电子工艺技术》2016年第5期253-256,263,共5页Electronics Process Technology

摘　　要：柔性电子以其独特的柔性/延展性,在信息、能源、医疗与国防等领域具有广泛的应用前景。而柔性电子技术的可弯曲及可延展特性对其封装技术提出了更高要求。以柔性电子封装技术为重点,综述柔性电子制造中的特殊工艺制程,包括倒装芯片技术和CIF(Chip in Flex)封装技术的研究进展,并展望柔性电子中封装技术的发展趋势。Due to its unique flexibility and ductility, flexible electronics has broad prospects in information, energy, medical treatment, national defense and other application. Due to its flexible and extensible characteristics, flexible electronic also puts forward higher requirements on its packaging technology. Mainly summary the special packaging process during the fabrication of flexible electronics, including flip chip and Chip in Flex （CIF） packaging technologies in flexible electronic packaging, and forecast its development trends of the electronic technology of flexible electronics.

关 键 词：柔性电子 电子封装工艺 倒装芯片技术 CIF封装 

分 类 号：TN305[电子电信—物理电子学]