基于金属基板与陶瓷基板的COB LED散热性能分析  

COB LED Thermal Performance Analysis Using Metal Substrate or Ceramic Substrate

作　　者：张剑平 文尚胜[2] 陈育 

机构地区：[1]广东金源照明科技有限公司,广东潮州521000 [2]华南理工大学高分子光电材料及器件研究所,广东广州510640

出　　处：《中国照明电器》2016年第10期10-12,17,共4页China Light & Lighting

基　　金：广东省扬帆计划项目(2015YT02C093)

摘　　要：随着COB LED光源功率不断增大,散热问题已成为影响其性能稳定性的重要因素。本文详细阐述电压法测量COB LED光源热学性能的工作原理及测试步骤,并测试分析两种不同基板材质的大功率COB LED光源散热性能。实验结果表明在同等条件下,采用铝基板的COB LED光源热阻更小,散热性能更佳。With the increasing of the power of COB LED, thermal performance has become an important factor that affects the stability of its performance. This paper describes in detail the working principle and testing steps of voltage method in the process of measuring thermal performance of LED COB light source, meanwhile tests and analyzes the heat dissipation performance of high power LED COB light source of two kinds of substrate materials. The experimental results show that, the LED COB light source with aluminum substrate has a lower thermal resistance and is better at heat dissipation performance under the same conditions.

关 键 词：LED 金属基板 陶瓷基板 散热性能 热阻 

分 类 号：TN312.8[电子电信—物理电子学]