电子设备无铅焊点的热疲劳评估进展与展望  

Evaluation and Prospect of Thermal Fatigue on Lead-free Solder Joints in Electronic Equipment

作　　者：景博[1] 胡家兴[1] 黄以锋[1] 汤巍[1] 盛增津[1] 董佳岩 

机构地区：[1]空军工程大学航空航天工程学院,西安710038

出　　处：《空军工程大学学报（自然科学版）》2016年第6期35-40,共6页Journal of Air Force Engineering University(Natural Science Edition)

基　　金：陕西省自然科学基金(S2015YFJM041)

摘　　要：随着电子器件的广泛应用,其表现出了较高的故障率,而热疲劳是表面贴装器件焊点失效的主要原因。通过分析总结国内外无铅焊点热可靠性研究,着重阐述了钎料Ag含量、焊点微观组织结构演变以及温度循环参数对无铅焊点寿命的影响,最后,论述了无铅焊点热可靠性研究在微观方面的发展趋势,以及在焊点物理失效模型建立和特征损伤参量提取等方面存在的研究挑战。Thermal fatigue is a major source of failure of solder joints in surface mount electronic compo- nents. Through analyzing and summarizing the lead-free solder joint thermal reliability at home and a- broad, this paper emphatically expounds the influence of the solder Ag content, thermal cycle parameters and solder joint microstructure on the thermal reliability of lead-free solder joints. Finally, the paper analy- zes the challenges and the developing trend of the lead-free solder joint thermal reliability. The hotspot and challenges in the future research by microstructure analysis and modeling, the influence of thermal load a- nalysis and the construction of physical failure model of solder joint, etc. are going to be researched fur- ther.

关 键 词：无铅焊点 Ag含量 温度循环 金属间化合物 Ag3Cu颗粒 再结晶 

分 类 号：TP206.3[自动化与计算机技术—检测技术与自动化装置]