超精度石英玻璃的化学机械抛光  

Chemical Mechanical Polishing of a Ultra Precision Quartz Glass

作　　者：王仲杰[1,2] 王胜利[1,2] 王辰伟[1,2] 张文倩[1,2] 郑环[1,2] 

机构地区：[1]河北工业大学电子信息工程学院,天津300130 [2]天津市电子材料与器件重点实验室,天津300130

出　　处：《微纳电子技术》2017年第1期48-52,共5页Micronanoelectronic Technology

基　　金：河北省自然科学基金资助项目(E2014202147);河北省自然科学基金青年基金资助项目(F2015202267);河北工业大学优秀青年科技创新基金资助项目(2015007);河北省研究生创新资助项目(220056);天津市自然科学基金资助项目(16JCYBJC16100)

摘　　要：在工作压力为2 psi(1 psi=6 894.76 Pa)、抛光头转速为55 r/min、抛盘转速为60 r/min、流量为50 mL/min的条件下,对3英寸(1英寸=2.54 cm)的石英玻璃(99.99%)进行化学机械抛光(CMP)实验。分别研究了磨料质量分数(4%,8%,12%,16%,20%)、FA/OⅠ型螯合剂体积分数(1%,2%,3%,4%,5%)和FA/O型活性剂体积分数(1%,2%,3%,4%,5%)对石英玻璃化学机械抛光去除速率的影响。实验结果表明:随着磨料质量分数增加,石英玻璃去除速率明显提高,从11 nm/min提升到97.9 nm/min,同时表面粗糙度(Ra)逐渐降低,从2.950 nm降低到0.265 nm;FA/OⅠ型螯合剂通过化学作用对去除速率有一定的提高,Ra也有一定程度的减小,能够降低到0.215 nm;FA/O型活性剂的加入会导致去除速率有所降低,但是能够使Ra进一步降低至0.126 nm。最终在磨料、FA/OⅠ型螯合剂、FA/O型活性剂的协同作用下,石英玻璃去除速率达到93.4 nm/min,Ra达到0.126 nm,远小于目前行业水平的0.9 nm。The chemical mechanical polishing（CMP）experiment of 3inches（1 inch =2.54 cm）quartz glass（99.99%）was carried out under the conditions of working pressure of 2 psi（1 psi=6 894.76 Pa）,polishing head rotational speed of 55 r/min,polishing disk rotational speed of60 r/min and flow rate of 50 mL/min.The effects of the abrasive mass fractions（4%,8%,12%,16%,20%）,FA/O Ⅰ chelating agent volume fractions（1%,2%,3%,4%,5%）and FA/O active agent volume fractions（1%,2%,3%,4%,5%）on the CMP removal rate of the quartz glass were researched,respectively.The experimental results show that with the increase of the abrasive mass fraction,the removal rate of the quartz glass increases significantly from11 nm/min to 97.9 nm/min.While the surface roughness（Ra）decreases gradually from2.950 nm to 0.265 nm.The chemical action of the FA/O Ⅰ chelating agent has a certain improvement on the removal rate,and the Raalso has a certain degree of reduction,and the Racan reduce to 0.215 nm.The addition of the FA/O active agent can reduce the polishing rate to a certain extent,but it can reduce the Ra to0.126 nm.Finally,under the synergistic action of the abrasive,FA/OⅠchelating agent and FA/O active agent,the removal rate of the quartz glass reaches 93.4 nm/min,and the Rareaches 0.126 nm which is far less than0.9 nm of the current industry level.

关 键 词：集成电路 石英玻璃 表面粗糙度 化学机械抛光(CMP) 去除速率 

分 类 号：TN305.2[电子电信—物理电子学]