再流焊锡珠的形成与预防  

The Formation and Prevention of the Soldering Balls at Reflow Soldering

作　　者：王丽 蔡小洪 

机构地区：[1]珠海格力电器股份有限公司,广东519070

出　　处：《电子质量》2002年第8期U023-U024,共2页Electronics Quality

摘　　要：SMD表面贴装器件在再流焊接时常有锡珠产生,锡珠会导致线路短路,造成产品的质量隐患;本文详细分析锡珠产生的原因,并提出预防措施。There are always bring out soldering balls at reflow solding SMD. Solding balls can cause short circuit. And cause hidden troubles at products. Now I analyze the reasons of how corne into being the solding balls. And give suggestion to prevent the production of solding balls.

关 键 词：表面贴装技术 再流焊接 焊膏 贴片 印刷电路板 

分 类 号：TN405[电子电信—微电子学与固体电子学]