焊接层空洞率对LED背光源组件热阻的影响  

Effects of Voiding Percentages in Devices Solder Layer on LED Back Light Unit Thermal Resistance

作　　者：刘志慧[1] 柴广跃[1] 闫星涛 刘琪 罗剑生 LIU Zhihui CHAI Guangyue YAN Xingtao LIU Qi LUO Jiansheng(Shenzhen University, Shenzhen 518060, China Shenzhen REFOND Optoelectronics Co. LTD, Shenzhen 518132, China)

机构地区：[1]深圳大学光电工程学院,广东深圳518060 [2]深圳市瑞丰光电子股份有限公司,广东深圳518132

出　　处：《照明工程学报》2016年第6期98-103,共6页China Illuminating Engineering Journal

基　　金：广东省前沿与关键技术创新专项资金(重大科技专项;2014B010120004)项目;广东省产学研项目(2011B090400400);深圳市重大产业攻关项目(JSGG20140519105124218)

摘　　要：焊接层空洞是引起电子器件和光电子器件失效的一种重要因素,同时也是应用系统可靠性研究的重要内容之一。它增大了焊接层的热阻使得功率半导体芯片由于散热不良而失效,本文通过实验研究了空洞率对LED背光源组件热阻的影响,结果显示随着焊接层空洞率的增大,样品结温与组件热阻都明显增加,且基本呈线性增长趋势,当空洞率约为17%时,热阻增长6.03%,结温提高1.74%;当空洞率约为73%时,热阻增长24.7%,结温提高9%。Void in solder layer is the main factor in the failure of electrical device and optoelectronic devices and the main question of the reliability of the application system. The increasing thermal resistance in solder layer is the main reason for the heat diffusion failure of power semiconductor chip. This paper focused on the effects of voiding percentages on LED back light unit thermal resistance. The results showed that with the increasing of voiding percentages, the junction temperature and the thermal resistance are increased significantly and almost appeared linear growth. When the voiding is about 17% , the thermal resistance and the junction temperature increase 6.03% and 1.74%. When the voiding is about 73% , the thermal resistance and the junction temperature increase 24.7% and 9%.

关 键 词：LED背光源 焊接层 空洞率 热阻 

分 类 号：TM923.34[电气工程—电力电子与电力传动]