混合集成电路隔离失效分析研究  

Analysisand Research on Isolation Failure for Hybrid IC

作　　者：肖玲[1] 郑旭[1] XIAO Ling ZHENG Xu(Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp. , Chongqing 400060, P. R. Chin)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2016年第6期854-858,共5页Microelectronics

摘　　要：隔离失效为混合集成电路典型失效模式。采用模糊FMECA的分析方法,对导致隔离失效的原因进行分析。建立模糊综合评判模型,得到"金属管壳与基板间焊膏量控制不当"是导致隔离失效的主要因素,"手工焊接控制不当"的危害度最高。利用模糊综合评判半定量化地找出主要失效原因,并分优先级解决问题。采取预防措施,可以有效提升产品的工艺可靠性。Isolation failure is a typical failure mode for hybrid IC.The reasons for causing isolation failure were analyzed by the fuzzy FMECA analysis method.A fuzzy comprehensive evaluation model was built and applied to the isolation failure analysis.Results showed that the main factor resulting in isolation failure was the poorly controlled solder dose between metal substrate and baseplate caused by handwork operation.The main failure reasons could be found out and prioritized by the fuzzy comprehensive evaluation method.Having taken preventive measures,the process reliability of manufacture could be effectively improved.

关 键 词：混合集成电路 模糊FMECA 模糊综合评判 隔离失效 

分 类 号：TN406[电子电信—微电子学与固体电子学]