沉积温度对磁控溅射镀钌薄膜微观结构和附着力的影响  

Effect of deposition temperature on microstructure and adhesion of ruthenium film plated by magnetron sputtering

作　　者：王盼[1] 潘应君[1] 洪波[1] 徐源源[1] 杨林[1] Wang Pan Pan Yingjun Hong Bo Xu Yuanyuan Yang Lin(College of Materials Science and Metallurgical Engineering, Wuhan University of Science and Technology,Wuhan 430081,China)

机构地区：[1]武汉科技大学材料与冶金学院,湖北武汉430081

出　　处：《武汉科技大学学报》2017年第1期23-26,共4页Journal of Wuhan University of Science and Technology

摘　　要：采用中频磁控溅射技术在钼圆片表面镀覆钌薄膜,通过X射线衍射仪、扫描电镜、平整度仪、宏观浸蚀试验和百格测试等对镀层进行表征和检测,研究不同沉积温度对薄膜微观结构和附着力的影响。结果表明,随着沉积温度由室温升至200℃,钌薄膜的表面平整性和致密性逐步改善,附着力得以提高;200℃沉积薄膜的膜/基结合力最大,其微观结构、致密性等也均达到最优;但当沉积温度进一步提高到300℃时,钌薄膜的表面起伏反而增大,附着力有所下降。Ruthenium films were prepared on molybdenum discs by intermediate frequency magnetron sputtering, then characterized and tested by X-ray diffractometer, scanning electron microscope, flat- ness tester, macro-etching test and cross cut test. Effects of deposition temperature on microstructure and adhesion of the films were discussed. The results show that the compactness, smoothness and ad- hesion of ruthenium film are improved with the increase of deposition temperature from indoor tem- perature to 200 ℃. Ru film deposited at 200℃ has the greatest coating-substrate adhesive force and the optimal microstructure and compactness. However, when the deposition temperature rises to 300 ℃, the surface fluctuation of ruthenium film increases and its adhesion declines.

关 键 词：钌薄膜 钼基片 磁控溅射 镀膜 沉积温度 附着力 微观结构 

分 类 号：TG174.444[金属学及工艺—金属表面处理]