无氰四元合金电镀工艺的研究  

Research on Non-cyanide Quaternary Alloy Electroplating Process

作　　者：车丽媛 吴昊 吕明威 夏阳[2] CHE Li-yuan WU Hao LU Ming-wei XIA Yang(WuHan Aobang Surface Technique Co. , Ltd. , WuHan 430023, China School of Chemistry, Chemical Engineering and Life Sciences, Wuhan University of Technology, WuHan 430070, China)

机构地区：[1]武汉奥邦表面技术有限公司,湖北武汉430023 [2]武汉理工大学化学化工与生命科学学院,湖北武汉430070

出　　处：《电镀与环保》2017年第1期19-22,共4页Electroplating & Pollution Control

摘　　要：研究出一种无氰四元合金电镀工艺。通过对四元合金镀层和镀液性能进行测试,确定了最佳的镀液组成与工艺条件为:Sn^(2+)3.0~4.0g/L,Co^(2+)0.8~1.2g/L,Cu^(2+)12.0~13.0g/L,V5+0.2~0.4g/L,DS6008A300~500mL/L,DS6008B150~250mL/L,30~40℃,pH值6.0~8.0,0.6~1.2A/dm2。A non-cyanide quaternary alloy electroplating process was developed. The optimum plating solution compositions and process conditions, which were determined through testing the performances of quaternary alloy coating and plating solution, were as follows. Sn2＋ 3.0-4.0 g/L, CoZ＋0.8-1.2 g/L, Cu2＋ 12.0-13.0 g/L, V5＋0.2-0.4 g/L, DS6008A 300-500 mL/L, DS6008B 150-250 mL/L, pH value 6.0-8.0, current density 0.6-1.2 A/dm2.

关 键 词：无氰 四元合金 镀液成分 工艺规范 

分 类 号：TQ153[化学工程—电化学工业]