直接敷铜工艺制备Cu/AlN材料的界面结构及结合性能  

Interface Structure and Bonding Properties of Cu/AlN Material Fabricated by Direct Bonded Copper Process

作　　者：谢建军[1] 王宇[1] 汪暾 王亚黎[1] 丁毛毛 李德善[1,2] 翟甜蕾 林德宝[1] 章蕾[1] 吴志豪 施鹰[1] XIE Jian-jun WANG Yu WANG Tun WANG Ya-li DING Mao-mao LI De-shan ZHAI Tian-lei LIN De-bao ZHANG Lei WU Zhi-hao SHI Ying(School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China Shanghai Ferrotec Corporation, Shanghai 200444, China)

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]上海申和热磁电子有限公司,上海200444

出　　处：《机械工程材料》2017年第1期61-64,共4页Materials For Mechanical Engineering

基　　金：上海市宝山区科委产学研项目(bkw2014124);上海市科研计划能力建设项目(14520500300)

摘　　要：通过直接敷铜(DBC)工艺,在AlN陶瓷基板表面于1 000~1 060℃的敷接温度下制备Cu/AlN材料,利用机械剥离机、场发射扫描电子显微镜和X射线衍射仪分析了Cu/AlN的界面结合强度、界面微观形貌和物相组成。结果表明:铜箔和AlN陶瓷基板间的结合强度超过了8.00N·mm^(-1),铜箔和AlN陶瓷之间存在厚度约为2μm的过渡层,过渡层中主要含有Al_2O_3、CuAlO_2和Cu_2O化合物;随着敷接温度升高,Cu/AlN的界面结合强度逐渐增大。By direct bonded copper（DBC）process,Cu/AlN material was fabricated successfully on AlN ceramic substrate at bonding temperatures of 1 000-1 060 ℃.The bonding strength,morphology and phase composition of Cu/AlN interface were investigated by mechanic testing equipment,field emission scanning electron microscope and X-ray diffractometer.The results show that the bonding strength of Cu/AlN interface was more than 8.0N·mm^-1,a transition layer with thickness of 2μm was found between copper foil and AlN ceramic,the transition layer was mainly composed of Al2O3,CuAlO2 and Cu2O.The bonding strength of Cu/AlN interface increased as the bonding temperature gradually went up.

关 键 词：表面金属化 直接敷铜工艺 ALN陶瓷 界面结合强度 

分 类 号：TH145[一般工业技术—材料科学与工程]