高热导率纳米银胶的可靠性研究  

Reliability of nano-silver adhesive with high thermal conductivity

作　　者：徐达[1] 常青松[1] 杨彦峰[1] XU Da CHANG Qingsong YANG Yanfeng(The 13th Research Institute, CETC, Shijiazhuang 050051, China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子元件与材料》2017年第2期82-84,共3页Electronic Components And Materials

摘　　要：对无压力低温固化纳米银胶的连接强度、导热性和导电性及其可靠性进行了研究,并与Au80Sn20焊料及普通导电胶进行对比。结果表明:纳米银胶连接强度高,平均剪切强度可达28 MPa;导热性能优异,连接层热阻接近Au80Sn20焊料层热阻;在严酷的热应力和机械应力试验后,其连接强度、导热性和导电性保持稳定,没有退化现象产生。因此,无压力低温固化的纳米银胶作为高功率器件连接材料具备较高的可靠性。The joining strength, thermal conduction, electric conductivity and long-term reliability of nano-silver adhesive cured under low temperature without pressure were studied, and then compared with Au80Sn20 binder and normal silver adhesive. The results indicate that the nano-silver adhesive has high joining strength, with an average shear strength of about 28 MPa, excellent thermal conduction, and its thermal resistance is close to that of Au80Sn20. The high thermal conduction and joining strength are not degenerated even after serious thermal and mechanical stress experiments. Therefore, the nano-silver adhesive cured under low temperature without pressure has high reliability as joining layer of high power device.

关 键 词：导电胶 纳米银胶 剪切强度 热导率 可靠性 大功率 

分 类 号：TM241[一般工业技术—材料科学与工程]