芯片键合制程中点胶浸润性问题的分析和改善  

Investigation and Improvement on Die Attachment Wettability during Die Bonding Process

作　　者：堵美军 

机构地区：[1]英飞凌(无锡)科技有限公司,江苏无锡214028

出　　处：《中国集成电路》2017年第1期66-70,88,共6页China lntegrated Circuit

摘　　要：芯片键合在半导体封装流程中是关键的一步。本文深入探讨了芯片键合时胶点缺失的特殊形成机理,并研究了键合胶的黏度的和胶点缺失不良率之间的关系,比较了不同材质点胶头对键合胶浸润性的影响,通过键合胶流变性的优化,点胶头材质的变更和表面状况的提高,改善了键合胶的浸润速率,提高了点胶头的表面能,彻底解决了胶点缺失的问题。Die bonding is a key process in semiconductor assembly. This paper studies the root cause of die attachment dot missing issue during die bonding. A correlation has been set up between die attachment dot missing ratio and die attachment viscosity. Also, it is revealed that material of die attachment dispenser tool has impact on die attachment wettability. Multiple improvement has been performed on die attachment viscosity and on dispensing tool material. As a result, die attachment wetting ability is improved and die attachment dot missing issue is solved.

关 键 词：芯片键合 表面能 黏度 浸润性 

分 类 号：TN405[电子电信—微电子学与固体电子学]