灌封胶对高量程微机械加速度计封装的影响  

Effect of the Potting Adhesive on the Packaging of High-g MEMS Accelerometers

作　　者：康强[1,2] 石云波[1,2] 王艳阳[1,2] 冯恒振 任建军[1,2] 

机构地区：[1]中北大学仪器科学与动态测试教育部重点实验室,太原030051 [2]中北大学电子测试技术重点实验室,太原030051

出　　处：《微纳电子技术》2017年第5期342-346,359,共6页Micronanoelectronic Technology

基　　金：国家自然科学基金杰出青年科学基金资助项目(51225504)

摘　　要：封装是高量程微机械加速度传感器高可靠性的重要保障,而灌封工艺是高量程微机械加速度传感器封装流程中一个非常重要的环节,对实现加速度传感器产业化具有重要的影响。根据一种自制的、量程为XX的压阻式高量程微机械加速度传感器的封装模式,利用有限元分析(FEA)方法建立加速度传感器的封装模型,基于FEA方法分析了灌封热应力及灌封工艺对加速度传感器性能的影响。分析结果表明:灌封胶的热膨胀系数和弹性模量是影响封装热应力的主要因素,而灌封胶的密度与封装热应力无关;灌封胶弹性模量及密度的变化对加速度传感器输出信号的影响很微弱,可以忽略不计。The packaging is the important safeguard for the high reliability of high-g MEMS accelerometers,and the potting process is the critical step in the packaging process of high-g MEMS accelerometers and has an important influence on the industrialization of accelerometers.According to a self-made piezoresistive high-g MEMS accelerometer with a measuring range of XX,the package model of the accelerometer was made by the finite element analysis（FEA）method,and the effects of the thermal stress of the potting and the potting process on the performances of the accelerometer were analyzed by the FEA method.The analysis results show that the thermal expansion coefficient and elastic modulus of the potting adhesive are the main factors on the thermal stress of the packaging,and the density of the potting adhesive has no connection with the thermal stress of the packaging.The output signal of the accelerometer is weakly affected by the elastic modulus and density of the potting adhesive,which is negligible.

关 键 词：灌封工艺 高量程微机械加速度计 封装 有限元分析(FEA) 热应力 

分 类 号：TN305.94[电子电信—物理电子学]