振动载荷下电路板级焊点失效信号表征及分析  

Characterization and Analysis of Board-Level Solder Joint Failure Signals Under Vibration Load

作　　者：董佳岩 景博[1] 黄以锋[1] 汤巍[1] 盛增津[1] 胡家兴[1] 

机构地区：[1]空军工程大学航空航天工程学院,西安710038

出　　处：《半导体技术》2017年第4期315-320,共6页Semiconductor Technology

基　　金：陕西省自然科学基金资助项目(2015JM6345);航空科学基金资助项目(20142896022)

摘　　要：针对板级焊点在振动载荷下的失效问题,搭建了具有焊点电信号监测功能的振动加速失效实验平台,在定频定幅简谐振动实验的基础上,对表征信号进行分析,通过电阻信号峰值标定焊点的失效程度。实验结果表明,焊点失效初期呈现为3个阶段,每个阶段包含电阻变化的平缓区间和陡变区间。随着3个阶段的改变,焊点低阻值区间振动循环数递减,焊点高阻值区间振动循环数递增。在此基础上,以电阻均值表征焊点平均失效程度,建立了表征焊点振动疲劳寿命的多项式模型,可以描述不同阶段焊点阻值和振动循环数的关系。Focusing on the failure problem of the board-level solder joint under vibration load, a vi- bration acceleration failure experiment platform with the function of monitoring the electric signal of the solder joint was built. On the basis of the constant frequency and amplitude simple harmonic vibration test, the characterization signal was analyzed and the failure degree of the solder joint was calibrated by the resistance signal peak value. The experimental results show that there are three stages in the initial stage of the solder joint failure, and each stage includes the smooth and abrupt change interval. With the change of three stages, the vibration cycles number of the low resistance zone of the solder joint decrea- ses, and the vibration cycles number of the high resistance zone of the solder joint increases. On this ba- sis, the average failure degree of solder joints was characterized by the mean value of resistance. A poly- nomial model was established to characterize the vibration fatigue life of solder joints, with which the relationship between the resistance value of solder joints and the vibration cycles number can be described.

关 键 词：焊点 简谐振动 加速失效实验 电信号 失效模式 多项式 

分 类 号：TN406[电子电信—微电子学与固体电子学]