基于先进封装的铜柱凸块技术  

Copper Pillar Bumping Technology Study on Advanced Electric-packages

作　　者：王学军[1] 张彩云[1] WANG Xuejun ZHANG Caiyun(The Second Research Institute of CETC, Taiyuan 030024, Chin)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2017年第2期99-101,共3页Electronics Process Technology

摘　　要：铜柱凸块技术用于实现集成电路封装的芯片基板互联,具有优越的电性能、热性能和可靠性,并可满足Ro HS要求。随着电子产品对小型化和轻量化的要求越来越高,铜柱凸块将逐渐取代锡铅凸块技术,实现更高密度的芯片互连,成为先进封装的主流技术。Copper pillar bumping technology provides the electrical contact of substrate and chips, improve reliability and enhance electrical and thermal connection characteristics, and meet the demands of RollS. With the higher dependence on minimization and lightweight of the electrical products, copper pillar bumping can achieve higher interconnect densities, and successively replace solder ball bumping, and will become mainstream technology in advanced electric-packages.

关 键 词：先进封装 铜柱凸块 焊料凸块 

分 类 号：TN605[电子电信—电路与系统]