半导体硅材料的清洗方法  

Cleaning Technology of Semiconductor Silicon Materials

作　　者：王艳茹[1] 李贺梅[1] WANG Yanru LI Hemei(The 46th Research Institute CETC,Tianjin 300220,Chin)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《天津科技》2017年第5期56-58,63,共4页Tianjin Science & Technology

摘　　要：半导体行业中的很重要的一道工序就是对半导体材料的清洗,这直接影响着半导体材料的质量及下游产品的性能。介绍了硅片表面污染的种类来源以及形成机理。对目前硅片主要清洗方法——RCA清洗法、超声清洗法、气相清洗法和其他清洗法的工作原理、清洗效果、适用范围等特点进行研究,分析了各种清洗方法的优缺点。最后,重点对半导体硅片传统的RCA清洗方法中各种清洗液的清洗原理、清洗特点、清洗局限进行了详细介绍。生产企业可根据实际生产情况和产品要求选择合适的清洗方法。In semiconductor industry,cleaning is an very important process,which could have an effect on the quality of semiconductors and downstream products’ performance. In this article,the species,origins and forming mechanisms of contamination on silicon wafer surface were introduced. A study about cleaning mechanisms,efficiencies and applications of main silicon wafer cleaning technologies,including RCA cleaning technology,ultrasonic cleaning technology,vapor phase cleaning technology and other cleaning technologies were made. The advantages and disadvantages about these clean-ing technologies were analyzed. At last,a detailed introduction about different cleaning solutions’ cleaning mechanisms,characteristics and limits in semiconductor silicon wafers’ traditional RCA cleaning technology was made. Enterprises could choose proper cleaning technologies according to actual production situation and product requirements.

关 键 词：硅片 表面污染 超声清洗 RCA清洗 

分 类 号：TN305.2[电子电信—物理电子学]