晶片的初始宏观形变对硅-硅直接键合的影响  

The Effection of the Initial Macroscopic Deformation on Si-Si Direct Bonding Wafer

作　　者：陈晨[1] 杨洪星[1] 

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工业专用设备》2017年第4期1-4,16,共5页Equipment for Electronic Products Manufacturing

摘　　要：采用建立了硅硅直接键合的简化模型,依据薄板理论分析了键合发生的条件以及原始晶片的曲率与键合后晶片曲率的关系;理论分析认为晶圆键合前有必要根据弯曲变形量来匹配键合晶圆,并通过试验进行了验证。This paper established a simplified model of Si-Si direct bonding, and according to the thin plate theory to analyzed the conditions of the bonding occurs and the relationship of original silicon wafers＇curvature and bonded wafer curvature. We think it is necessary to matching appropriate wafers according to the bending deformation before bonding process, and this idea had been verified through experiments.

关 键 词：键合 弯曲变形 翘曲度 

分 类 号：TN305.96[电子电信—物理电子学]