扫描式磁控溅射设备及工艺研究  

Research of Scanning Magnetron Sputtering Equipment and Production Technology

作　　者：范江华[1] 胡凡[1] 彭立波[1] 程文进[1] 佘鹏程[1] 毛朝斌[1] 

机构地区：[1]中国电子科技集团公司第四十八研究所,湖南长沙410111

出　　处：《电子工业专用设备》2017年第4期39-42,71,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了一种扫描式双腔连续生产型磁控溅射镀膜设备,通过研究不同溅射压强、溅射功率密度下金属薄膜的沉积速率以及沉膜均匀性,实验结果表明在溅射压强0.3 Pa、溅射功率密度9 W/cm^2的条件下沉积TiW薄膜的沉膜速率约41.5 nm/min,均匀性低于4%;沉积Cu薄膜的沉膜速率约95.2 nm/min,均匀性低于3%,符合电子器件镀膜工艺需求。This paper introduced a kind of scanning magnetron sputtering coating equipment with dual cavity that couldproduce continuously. The deposition rate and uniformity of metallic thin film were studied under different sputtering pressure and sputtering power density.When the sputtering pressure was 0.3 Pa and sputtering power density was 9 W/cm2, the experimental results showed that the deposition rate of TiW thin filmwas about 41.5 nm/min, the uniformity was less than 4%, and Cu thin filmis about 95.2 ran/rain, the uniformity is less than 3%. Therefore, the device met the requirements of electronic device coating.

关 键 词：磁控溅射 薄膜 工艺实验 扫描 沉积 

分 类 号：TN305.92[电子电信—物理电子学]