集成电路封装用绝缘胶漏电失效分析  

Analysis of Leakage Failure of Insulation Adhesive in IC Package

作　　者：黄炜[1] 付晓君[1] 徐青[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2017年第4期590-592,共3页Microelectronics

摘　　要：在电子元器件封装领域中,塑封器件正逐步替代气密性封装器件。目前工业级塑封器件已不能满足器件的高可靠性要求,工业级塑封器件在严酷的环境应力试验中经常出现失效。研究了工业级塑封器件在可靠性筛选试验中出现失效的问题,通过X射线观察和芯片切面分析等方法,查明了造成器件失效的原因,并提出了优化改进措施。Hermetic encapsulated devices were gradually replaced by plastic encapsulated devices in the field of electronic packaging. But the current industrial-grade encapsulated devices could not meet the requirement of high reliability. The industrial-grade plastic encapsulated devices often failed in harsh environmental stress tests. In the reliability screening test,the failures of industrial-grade encapsulated devices were studied. The reasons of failure were found out by means of X-ray observation and chip section analysis,and the optimization and improvement measures were put forward.

关 键 词：塑封器件 绝缘胶 漏电失效 失效分析 

分 类 号：TN305.94[电子电信—物理电子学] TN306