一种PTFE高频覆铜板的钻孔工艺研究  

Study on PCB Drilling Orthogonal Experiment Used for a Novel High Frequency Laminate

作　　者：邹嘉佳[1] 赵丹[1] 范晓春[1] 管美章[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2017年第5期262-264,307,共4页Electronics Process Technology

基　　金：国防科工局基金项目(项目编号:JPPT-125-GJGG-17)

摘　　要：PTFE基高频覆铜板在加工前期工序的机械钻孔中,质量不易受控制。通过对一种新型高频介质板进行0.3 mm微小孔的钻孔工艺实验,采用正交试验极差分析方法和Minitab数据分析,对机械钻孔参数进行了数据处理和优化选择,从而得出最优的参数组合,有效避免了PTFE板材在钻孔过程中可能产生的孔壁粗糙、铜瘤等不良问题。The quality of the drilling process for polytetrafluoroethylene（PTFE） circuit board is not easy to be controlled. A novel kind of PTFE laminate which is in great demand in electronic circuit industry is selected as the research object by the method of orthogonal experiments and analyzed by Minitab. The PCB drilling parameters are analyzed and investigated so as to get the best parameter combination which can effectively solve the problems of the rough of hole-wall and copper tumor during the process of drilling.

关 键 词：高频覆铜板 机械钻孔 正交试验 Minitab 

分 类 号：TN41[电子电信—微电子学与固体电子学]