应用于Ka波段无线通信的发射前端模块设计与制造  

Design and manufacture of transmitting front-end module for wireless communication in Ka-band

作　　者：陈守维 王启东[1,2] 陈诚 李君[1,2] 汪鑫 曹立强[1,2] 陆原 

机构地区：[1]中国科学院微电子研究所系统封装与集成研发中心,北京100029 [2]华进半导体封装先导技术研发中心有限公司,江苏无锡214135

出　　处：《现代电子技术》2017年第21期39-42,共4页Modern Electronics Technique

基　　金：国家高技术研究发展计划(863计划)(2015AA016904);国家科技重大专项(2013ZX02502)资助

摘　　要：介绍一种应用于Ka波段无线通信的发射前端模块,该模块由混频器、微带滤波器、压控振荡器、倍频器、功率放大器构成。射频(RF)信号工作在27.4~28 GHz频段内,中频信号固定在1 GHz。仿真结果显示,在工作频段内发射前端增益超过10 dB,发射功率为11.823 dBm,并且交调信号被抑制在63 dBc以下。在全部芯片工作的条件下,温度仿真结果显示芯片的结温低于64℃。测试结果显示,在工作频段内输出端信号线插入损耗低于0.34 dB,回波损耗小于-20 dB,VCO的8分频输出功率是-10.66 dBm。A transmitting front-end module for wireless communication in Ka-band is introduced,which is composed of the frequency mixer,microstrip filter,voltage-controlled oscillator(VCO),frequency multiplier and power amplifier. When the RF signals work at 27.4~28 GHz,the intermediate-frequency signal is fixed in 1 GHz. The simulation results show that the gain of the transmitting front-end is more than 10 dB,the transmitting power is 11.823 dBm,and the intermodulation signal is suppressed below 63 dBc while the signal works within the working frequency band. When all chips are working,the temperature simulation result show that the junction temperature of the chip is below 64 ℃. The test results show that,when the signal works within the working frequency,the insertion loss of the signal line in output terminal is less than 0.34 dB,the return loss is less than -20 dB,and the VCO output power after 8 frequency division is-10.66 dBm.

关 键 词：发射前端 温度 KA波段 射频信号 

分 类 号：TN828-34[电子电信—信息与通信工程]