基板非圆过孔的信号完整性和电源完整性研究  

The Development of Signal Integrity and Power Integrity for Via of Package Substrate

作　　者：刘琦 刘卫东 陈兴隆 王昕捷 

机构地区：[1]华天科技(西安)有限公司,西安710018

出　　处：《电子与封装》2017年第12期5-8,共4页Electronics & Packaging

摘　　要：随着科技的发展,半导体芯片的电源电压越来越小,电流越来越大,信号速度越来越高,从而导致电源完整性和信号完整性问题日益突出。对于一个电子系统来说,其电源完整性问题和互连的信号完整性问题来源包括芯片晶圆、封装、连接器、背板等,封装的电源完整性问题和信号完整性问题必须引起足够的重视。基板类封装中,过孔作为信号网络不同层之间的连接通道,其设计不当往往会造成严重的电源完整性问题和信号完整性问题。针对一种非圆形过孔应用于基板的电源完整性和信号完整性进行了研究,并对应用背景以及使用圆形过孔对其等效进行了探讨。With the development o f since and technology, the power supply the voltage of semiconductor chip is lower and lower, the current is more and more higher and the signal speed is faster and faster to result in the problem of power integrity and signal integrity getting increasingly prominent, it is not neglectful for package due to the main sources o f power integrity and signal integrity problem o f an electronic system include in die # package # connector # backplane, etc. If via being as a passageway between different layers o f interconnection in package substrate can＇t design well, the serious power integrity and signal integrity problem will arise. In this paper#signal integrity and power integrity o f noncircular via used to package substrate are researched, and discussing the application background and the equivalent circular via o f noncircular via.

关 键 词：芯片封装 过孔 电源完整性 信号完整性 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]