一种3层无芯基板制造过程及翘曲变形模拟和机理分析  

A Manufacturing Process and Warpage Simulation of Three-layers Coreless Substrate

作　　者：李茂源[1] 刁思勉 刘家欢 邓天正雄 李阳[1] 

机构地区：[1]华中科技大学材料科学与技术学院,武汉430074 [2]深圳市烨嘉为技术有限公司,广东深圳518000

出　　处：《电子与封装》2017年第12期9-13,共5页Electronics & Packaging

摘　　要：制造与装配过程的翘曲问题是应用无芯基板最大的挑战之一,其主要原因是不同材料间热机械性能不匹配所造成的。介绍了一种3层无芯基板的制造过程,并利用有限元软件ABAQUS6.10对该过程进行了模拟。通过对模拟结果与实验测试结果的对比,再对翘曲变形的机理进行分析,对比了不同因素对翘曲变形大小的影响,对减少翘曲变形给出了有效的工艺设计建议。Due to the fact that the thermomechanical properties o f the different materials do not match, the warpage during the manufacturing and assembly process is one o f the biggest challenges in applying the coreless substrate. In the paper, a manufacturing process of a coreless substrate is introduced. The process is simulated by the finite element software ABAQUS6.10. The influence o f different factors on the warpage is analyzed by analyzing the simulation results and the mechanism o f warping deformation, and the helpful suggestion has been given to reduce the warpage.

关 键 词：无芯基板 翘曲 ABAQUS 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]