基于各向异性导电胶的板间垂直互连研究  

A Study on Vertical Interconnection between Substrates Based on Anisotropic Conductive Adhesives

作　　者：刘维红 王帆 周六可 

机构地区：[1]西安邮电大学电子工程学院,西安710121

出　　处：《固体电子学研究与进展》2017年第4期294-298,共5页Research & Progress of SSE

基　　金：陕西省教育厅服务地方专项计划项目(15JF029);国防基础科研项目(JCKY2016203C081)

摘　　要：提出一种基于各向异性导电胶(ACA)的封装方法,即利用ACA实现介质基板之间垂直互连过渡。该方法与传统的锡铅焊料工艺相比,ACA板间互连工艺具有互连距离短、固化温度低、工艺流程简单、绿色环保等特点。测试结果表明,ACA在垂直互连过程中拥有良好的微波传输性能。在0.1~19.0GHz内,回波损耗小于-10dB,插入损耗小于1.5dB;在26~30GHz频段范围内,回波损耗小于-10dB,插入损耗小于3dB。测试结果与电磁仿真结果吻合。A novel packaging method based on anisotropic conductive adhesives （ACA） was proposed in this paper, in which the ACA was used to realize the vertical interconnection between substrates. Compared with the traditional tin-lead solder technology, anisotropic conductive ad- hesives technology has the characteristics of short interconnection distance, low curing tempera- ture, simple process, environmental protection, and so on. The test results show that ACA has good microwave transmission performance in the vertical interconnection process. The return loss is less than -10 dB and the insertion loss is less than 1.5 dB in the range of 0.1-19.0 GHz. The return loss is less than -10 dB and the insertion loss is less than 3 dB in the range of 26-30 GHz. The test results are in good agreement with the simulation results.

关 键 词：垂直互连 微波传输性能 各向异性导电胶 

分 类 号：TN45[电子电信—微电子学与固体电子学]