基于微型焊球的高密度叠层自适应封装技术  

High Density Stacked Adaptive Packaging Technology Based on Micro Solder Ball

作　　者：邱钊[1] 

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电子与封装》2018年第2期9-12,共4页Electronics & Packaging

摘　　要：为了有效解决Ka频段信号在多层高密度叠层基板之间传输处理过程中的电气互联瓶颈问题,通过采用微型焊球在层间实现信号的垂直互联和支撑连接的方法,同时实现高密度叠层自适应封装,完成了一个高密度集成的小型化毫米波SIP低传输损耗模块的制作。对工作在Ka频段基于微型焊球的高密度叠层自适应封装的设计、制造工艺过程进行了深入研究,开拓了高密度叠层自适应封装微型焊球塌陷率精准控制工艺,基于微型焊球垂直互联以及电磁隔离的设计、SIW滤波器内埋、高密度多层基板焊接工艺等。In order to effectively solve the problem of electrical interconnection bottleneck in the transmission process ofKa band signals between multilayer high-density stacked substrates, we use the micro solder sphere to achieve vertical interconnection and support connectionbetween layers, while achieving high density stacked adaptive package, which made a high density integrated miniaturized millimeter wave SIP low transmission loss module. We studied he design and fabrication process of high density stacked adaptive packaging based on micro solder sphere in K a band and w e have broken through the high density stacked adaptive packaging micro solderball collapse rate accurate control process, vertical interconnection and electromagnetic isolation design based onthe micro solderball, S I W filter embedded, welding technology ofhigh density multilayer substrate.

关 键 词：自适应封装 高密度叠层 垂直互联 

分 类 号：TN305.94[电子电信—物理电子学]