功能梯度材料多层结构界面裂纹的热弹性分析（英文）  

Thermoelastic Analysis of FunctionallyGraded Layered Structures with An Interface Crack

作　　者：丁生虎 杜昕鲲 龙品红 

机构地区：[1]宁夏大学数学统计学院,宁夏银川750021

出　　处：《宁夏大学学报（自然科学版）》2018年第1期17-25,共9页Journal of Ningxia University(Natural Science Edition)

基　　金：Supported by Outstanding Youth Cultivation Project of Ningxia Higher Education(NGY2017002)~~

摘　　要：基于傅立叶导热理论,得到了功能梯度夹层结构中部分绝缘裂纹周围的温度和热应力.材料性能假定沿厚度方向成指数函数变化.利用傅立叶变换技术,得到了与温度和热应力场有关的奇异积分方程组,并进行了数值求解.数值结果揭示了材料梯度参数和部分导热系数对裂纹面温度和热应力强度因子的影响.The temperature and thermal stresses around a partially insulated crack in a functionally graded sandwich structures is obtained based on the theory of Fourier heat conduction.The materials properties are assumed to vary as an exponential function of thickness direction.By using Fourier transforms technique,a system of singular integral equations related to the temperature and the thermal stress field are obtained and solved numerically.Numerical results are given to reveal the influence of the material graded parameters and the partially thermal conductivity on the temperatures along the crack plane and the thermal stress intensity factors(TSIFS).

关 键 词：非均匀材料 夹层结构 裂纹 傅立叶变换 奇异积分方程 

分 类 号：O174.5[理学—数学] O346.1[理学—基础数学]