全球集成电路设计、晶圆代工业、封装测试业的发展状况分析  

Development of Global IC Design, Wafer Foundry and Backend Industry

作　　者：王龙兴 

机构地区：[1]上海市集成电路行业协会,上海201203

出　　处：《集成电路应用》2018年第2期52-56,共5页Application of IC

基　　金：上海市软件和集成电路产业发展专项基金(2016.160505)

摘　　要：扩展产能和新技术开发是半导体产业两大投资方向。2016年全球新增5条12英寸晶圆生产线投产。全球集成电路主流技术为16/14 nm,2016年年底三星和台积电导入10 nm技术,2017年第一季度进入量产。由于10 nm是过渡性节点,2017年全球技术领先厂商将提前展开7 nm技术研发竞争。2016年全球IC设计业规模为774.9亿美元,衰减3.2%;封测业规模为509.7亿美元,微增0.02%;晶圆代工业规模为500.5亿美元,大增11.4%,显示出勃勃生机。The expansion of capacity and the development of new technology are the two major investment direction of the semiconductor industry. In 2016, 5 new 12 inch wafer production lines were added to the world. The mainstream technology of the global integrated circuit is 16/14nm. At the end of 2016, Samsung and TSMC introduced 10nm technology and entered the production in the first quarter of 2017. Since 10 nm is a transitional node, the world＇s leading technology manufacturers will start the 7 nm technology and the competition in advance in 2017. In 2016 the global IC design industry was $77 billion 490 million, decreased 3.2%; packaging and testing industry was $50 billion 970 million, a slight increase of 0.02%; the foundry industry was $50 billion 50 million, increased 11.4%, showing vitality.

关 键 词：集成电路制造 晶圆代工 封装测试 

分 类 号：TN405[电子电信—微电子学与固体电子学] F416.63[经济管理—产业经济]