MEMS-based thermoelectric infrared sensors： A review  

作　　者：Dehui XU Yuelin WANG Bin XIONG Tie LI 

机构地区：[1]Science and Technology on Microsystem Laboratory, Shanghai Instituteof Microsystem and Information Technology, CAS, Shanghai 200050,China

出　　处：《Frontiers of Mechanical Engineering》2017年第4期557-566,共10页机械工程前沿（英文版）

摘　　要：In the past decade, micro-electromechanical systems （MEMS）-based thermoelectric infrared （IR） sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation micro- structures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.In the past decade, micro-electromechanical systems （MEMS）-based thermoelectric infrared （IR） sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation micro- structures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

关 键 词：thermoelectric infrared sensor CMOS-MEMS THERMOPILE MICROMACHINING wafer-level package 

分 类 号：TH-39[机械工程] TP212[自动化与计算机技术—检测技术与自动化装置]