阻挡层抛光中布线槽铜电阻R_s的控制机制研究  

Mechanism of Wiring Groove Copper Resistance Control for Barrier Layer Polishing

作　　者：岳昕 刘玉岭 王辰伟 郑环 李祥州 Yue Xin;Liu Yuling;Wang Chenwei;Zheng Huan;Li Xiangzhou(Tianjin Key Laboratory of Electronic Materials and Devices, School of Electronic and Information Engineering, Hebei University of Technology, Tianjin 300130, China)

机构地区：[1]河北工业大学电子信息工程学院天津市电子材料与器件重点实验室

出　　处：《稀有金属》2018年第4期386-392,共7页Chinese Journal of Rare Metals

基　　金：国家科技中长期发展规划02重大专项项目(2016ZX02301003-004-007);河北省青年自然科学基金项目(F2015202267);河北工业大学优秀青年科技创新基金项目(2015007)资助

摘　　要：布线槽处铜线条的电阻Rs关系着集成电路的响应速度和芯片的电特性。阻挡层抛光的过程中会造成布线槽处铜线条电阻Rs的变化,为了实现Rs的变化可控,使用FA/O螯合剂和JFC活性剂进行实验测试和机制研究。测试结果表明布线槽铜线条电阻Rs的变化取决于铜线条厚度的大小,铜线条厚度的大小是由铜线条去除速率VCu决定的。对含有不同浓度FA/O螯合剂和JFC活性剂的抛光液进行电化学实验研究,结果表明螯合剂FA/O对Cu^2＋有很强的螯合作用,可以促进抛光液对布线槽铜线条的化学作用,提高布线槽铜线条的去除速率VCu;活性剂JFC对布线槽铜线条表面有很强的钝化作用,可以抑制抛光液对布线槽铜线条的化学作用,减小布线槽铜线条的去除速率VCu。利用螯合剂FA/O的强螯合作用和活性剂JFC的强钝化作用实现了布线槽铜电阻Rs的控制。Wiring groove copper resistance was related to the response speed of integrated circuit and electrical of the chip.The wiring groove copper resistance was changed in the process of barrier layer polishing.In order to control the change of resistance,the FA/O chelating agent and JFC surfactant were used in experiment test and mechanism research.The results showed that the change of wiring groove copper resistance depended on the thickness of wiring groove copper,and the thickness of wiring groove copper was determined by the copper removal rate.The dissolution of different concentration FA/O chelating agent and JFC surfactant was further studied by electrochemical experiments,which indicated FA/O chelating agent of a very strong chelation to Cu^2＋,and it could promote the chemical action of slurry and increase the copper removal rate; JFC surfactant had a very strong inactivation to the surface of wiring groove copper line; it could restrain the chemical action of slurry and decrease the copper removal rate.Using the chelation of FA/O chelating agent,the inactivation of JFC surfactant realized the control of wiring groove copper resistance.

关 键 词：布线槽 铜线条 电阻 阻挡层 钝化层 

分 类 号：TN405[电子电信—微电子学与固体电子学]