激光盲孔对位应用研究  

Application and Research of Laser Blind Hole Alignment

作　　者：许伟廉 常选委 郭茂桂 陈世金 潘湛昌[2] 陈世荣[2] 郑李娟 王成勇[2] XU Wei-lian;CHANG Xuan-wei;GUO Mao-gui;CHEN Shi-jin;PAN Zhan-chang;CHEN Shi-rong;ZHENG Li-juan;WANG Cheng-yong

机构地区：[1]博敏电子有限公司,广东梅州514768 [2]广东工业大学轻工化工学院,广东广州510006

出　　处：《印制电路信息》2018年第6期12-15,共4页Printed Circuit Information

摘　　要：文章针对HDI板在线路LDI曝光对位方式出现盲孔偏现象提出了相应的改善方案,讨论了对位盲孔填平、板面色差、人工手动识别以及线路层偏问题对线路LDI曝光识别的影响,从而能够实现激光盲孔层间精准对接,保证HDI板的电气性能。Based on HDI board online LDI exposure with blind hole slant phenomenon, this article put forward corresponding improvement plan. It discussed the effect of blind hole filling, plate color difference, manual identification and layer misregistration on line LDI exposure recognition, which can realize the precise docking between the laser blind holes and ensure the electrical properties of HDI board

关 键 词：高密度互连板 激光直接成像 激光盲孔对位 

分 类 号：TN41[电子电信—微电子学与固体电子学]