覆铜氮化铝陶瓷基板失效机理分析  

Preliminary Study on Failure Mechanism of Ceramic Substrates

作　　者：张珊珊 杨理航 王燕斌[1] 颜鲁春[1] 高克玮[1] 万晓玲 张雷 杨会生[1] ZHANG Shan-shan;YANG Li-hang;WANG Yan-bin;YAN Lu-chun;GAO Ke-wei;WAN Xiao-ling;ZHANG Lei;YANG Hui-sheng(School of Materials Science and Engineer,University of Science and Technology Beijing,Beijing 100083,China;School of Chemistry and Biological Engineering,University of Science and Technology Beijing,Beijing 100083,China)

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]北京科技大学化学与生物工程学院,北京100083

出　　处：《真空电子技术》2018年第4期1-7,共7页Vacuum Electronics

摘　　要：陶瓷线路板的耐热循环性能是其可靠性关键参数之一。本文对陶瓷基板在反复周期性加热过程中发生的变形情况进行了研究。通过实验发现,陶瓷覆铜板在周期性加热过程中,存在类似金属材料在周期载荷作用下出现的棘轮效应和包辛格效应。结合ANSYS有限元计算结果,可以推断,陶瓷线路板的失效开裂与金属层的塑性变形或位错运动直接相关。另外,活性金属钎焊陶瓷基板的结构稳定性优于直接覆铜陶瓷基板。The thermal cycling performance of ceramic circuit board is one key parameter of its reliability.In this paper,the deformation of ceramic substrate occurring in repeated periodic heatingprocess was studied.It is found that there are ratchet effect and Bauschinger effect on ceramic substrates,which are similar to those of metal materials under cyclic loading.Combining with ANSYS finite element calculation results,it is deduced that the failure cracking of ceramic substrates is directly related to the plastic deformation or dislocation motion of copper layer.In addition,the thermal cycling stability of active metal brazing substrate is better than that of direct bonding copper ceramic substrate.

关 键 词：ALN 陶瓷基板 残余应力 滞后环 棘轮效应 包辛格效应 

分 类 号：TQ174.75[化学工程—陶瓷工业]